Pb Free and XRF Screening

Oracle Components has the capability to change the terminal finish on BGA and QFP components in line with RoHS directive 2002/95/EC as defined by Jedec Standard JESD97.

Also capable of non-destructive analysis and verification in line with RoHS directive.
X-Ray Fluorescence Testing for WEEE/RoHS and ELV European Directives.


BGA solder removed to
copper pad  
BGA/QFP terminal finish
conversion  
Coplanarity testing for BGA
and QFP 

 
Options for conversion include:Terminal finish from Pb-Free to Pb Terminal finish from Pb to Pb-Free

Stock holding considerations for conversion:Last time buys Obsolete stock End of Life Product

Other complimentary services include:Double dip for gold leaded devices (de-golding) Lead forming and lead alignment Component harvesting from assembled board

XRF Screening Non destructive analysis of electronic equipment and components for
banned and restrictive use substances. Testing and verification for compliance to RoHS, WEEE, and EVL.

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email sales@oraclecomponents.com                                    

Oracle Components, (AKA ICsrus) The needle in the haystack.